Roger A Mock

Title: The Innovations of Roger A. Mock

Introduction

Roger A. Mock is a notable inventor based in Kokomo, IN (US). He has made significant contributions to the field of integrated circuit packaging, holding a total of 4 patents. His work has been instrumental in advancing technology in this area.

Latest Patents

Among his latest patents is a dual-sided substrate integrated circuit package that includes a leadframe with leads of increased thickness. This innovative integrated circuit package features a first non-conductive substrate and a second non-conductive substrate, with a die positioned between their inner surfaces. The leadframe is designed with a member that has a proximal end and a distal end, where the proximal end has a thickness less than that of the die. The distal end is uniquely undulated, providing an effective thickness greater than the proximal end, enhancing the overall functionality of the package.

Career Highlights

Roger has worked with prominent companies such as Delphi Technologies, Inc. and Delco Electronics Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Throughout his career, Roger has collaborated with talented individuals, including Erich William Gerbsch and Charles T. Eytcheson. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Roger A. Mock's contributions to the field of integrated circuit packaging are noteworthy. His innovative patents and collaborations reflect his dedication to advancing technology. His work continues to influence the industry and inspire future innovations.