Delphi Technologies, Inc.

Delco Electronics Corporation

Roger A Mock

Erich William Gerbsch

Charles T Eytcheson

Ralph S Taylor

Jeffrey J Ronning

Michael A Jeter

Todd G Nakanishi

Lisa A Viduya

Robert J Campbell

Monty B Hayes

Andrew R Hayes

Eric Von Kierstead

Erich W Gerbsch

An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.

Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness

An electronics assembly is provided, including a housing and at least one electronic power device positioned within. A heat sink device is positioned within the housing and is in thermal communication with the electronic power device . The heat sink device includes a fluid vessel , a fluid input port , a fluid output port , and at least one fin insert brazed into the fluid vessel . The heat sink device is in fluid communication with an automotive radiator such that coolant flows from the automotive radiator through the fluid vessel thereby cooling the electronic power device

Automotive electronics heat exchanger

A parallel dual switch module that is characterized by improved mechanical and electrical packaging efficiency and low cost. The module includes a common terminal defined by a first stamped elongate metal plate insert molded into the module housing, and positive and negative terminals defined by second and third stamped elongate metal plates disposed side-by-side atop the common terminal. Connection areas formed on the positive and negative terminals extend in opposite lateral directions, and interdigitate with connection areas formed on the common terminal, thereby forming two linear parallel rows of connection areas. Adjacent each row of connection areas, and mounted on a baseplate of the module is a set of parallel connected transistors subassemblies. A molded elongate gate collection component is mounted on the baseplate between the sets of transistor subassemblies, and beneath the common terminal. The gate collection component confines a pair of insert molded gate terminal strips to which the gate terminals of the respective sets of transistor subassemblies are connected, and the terminal strips, in turn, are coupled to gate terminals of the module. The transistor subassemblies are mounted in close proximity to the central terminal structure, and the metal tabs of the subassemblies are shaped to prevent interference with the overlying terminal connection areas, and to provide stress relief.

Parallel dual switch module

Growing community of inventors

Kokomo, IN, United States of America

Roger A Mock