Roelf A J Groenhuis

Title: Roelf A J Groenhuis: Innovator in Semiconductor Technology

Introduction

Roelf A J Groenhuis is a notable inventor based in Nijmegen, Netherlands. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to device packaging.

Latest Patents

One of his latest patents is for a packaged semiconductor device with interior polygonal pads. This invention includes a semiconductor chip and a package structure that defines a rectangular boundary. The bottom surface of the package structure features interior polygonal pads that are exposed and located on a centerline, as well as edge polygonal pads positioned at the edges of the rectangular boundary. Notably, one edge polygonal pad is situated near each corner of the rectangular boundary. The design of the interior polygonal pads is such that a line connecting at least one vertex of each pad runs parallel to an edge of the package structure's rectangular boundary.

Career Highlights

Roelf has worked with prominent companies in the semiconductor industry, including NXP B.V. and Nexperia B.V. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor packaging.

Collaborations

Some of his notable coworkers include Kan Wae Lam and Clifford J Lloyd, who have collaborated with him on various projects throughout his career.

Conclusion

Roelf A J Groenhuis is a distinguished inventor whose work in semiconductor technology has led to valuable patents and advancements in the field. His contributions continue to influence the industry and inspire future innovations.