This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 1998.
Company Filing History:
Years Active: 1998
Title: Rodney K Rose: Innovator in Integrated Circuit Technology
Introduction
Rodney K Rose is a notable inventor based in Roseville, CA (US). He has made significant contributions to the field of integrated circuit technology. His innovative work has led to the development of a unique patent that enhances the functionality of integrated circuit packages.
Latest Patents
Rodney K Rose holds a patent for a "Contact pad extender for integrated circuit packages." This invention features an integrated circuit package that includes a fan assembly mounted to the package. The design incorporates a printed circuit board substrate with a top surface, an opposite bottom surface, and an inner die cavity. A plurality of pins extend from the bottom surface of the substrate, allowing the package to connect to an external printed circuit board. Additionally, a metal lid can be mounted to the top surface to enclose the integrated circuit located within the die cavity. The integrated circuit may be mounted to the lid and is electrically coupled to the pins through various routing features of the package. The package also includes several metal disks soldered to corresponding surface pads on the top surface of the substrate, with the lid exposing these disks. A fan assembly is connected to the lid and receives electrical current through the package.
Career Highlights
Rodney K Rose is currently employed at Intel Corporation, where he continues to innovate and contribute to advancements in technology. His work at Intel has allowed him to collaborate with other talented professionals in the field.
Collaborations
Rodney has worked alongside Duncan D MacGregor, further enhancing the collaborative spirit within the innovative environment at Intel Corporation.
Conclusion
Rodney K Rose's contributions to integrated circuit technology exemplify the spirit of innovation. His patent for the contact pad extender showcases his ability to solve complex engineering challenges. Through his work at Intel Corporation, he continues to push the boundaries of technology and inspire future advancements.