Shanghai, China

Robertito Piaduche

This inventor holds 1 USPTO granted patent. Top assignee: Sandisk Corporation. Active years: 2010.


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Robertito Piaduche

Introduction

Robertito Piaduche is a notable inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique method for reclaiming semiconductor packages.

Latest Patents

Robertito holds a patent for a "Method for reclaiming semiconductor package." This method involves forming a semiconductor card by reclaiming a semiconductor package that has a damaged controller die. The reclaim process includes severing the electrical connections between the controller die and the semiconductor package substrate without exposing the passive component. In one embodiment, the cutting tool used comprises a saw blade. An electrically insulating material is deposited over the exposed bond wires to complete the reclaim process. The reclaimed package and a new controller die are then affixed to a second substrate to electrically couple the memory die of the reclaimed package with the new controller die, ultimately forming a new package. This new package is encapsulated to create a new memory card.

Career Highlights

Robertito Piaduche is currently employed at SanDisk Corporation, where he continues to innovate in the semiconductor field. His work has been instrumental in advancing the technology used in memory cards and semiconductor packages.

Collaborations

Robertito has collaborated with talented coworkers, including King Hoo Ong and Ning Ye. Their combined expertise has contributed to the success of various projects within the company.

Conclusion

Robertito Piaduche's innovative methods and contributions to semiconductor technology highlight his importance in the field. His patent for reclaiming semiconductor packages showcases his ability to solve complex problems and advance technology.

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