The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2010
Filed:
Jun. 30, 2008
King Hoo Ong, Shanghai, CN;
Robertito Piaduche, Shanghai, CN;
Ning YE, San Jose, CA (US);
Hem Takiar, Fremont, CA (US);
King Hoo Ong, Shanghai, CN;
Robertito Piaduche, Shanghai, CN;
Ning Ye, San Jose, CA (US);
Hem Takiar, Fremont, CA (US);
SanDisk Corporation, Milpitas, CA (US);
Abstract
A method of forming a semiconductor card. A semiconductor package having a damaged controller die is reclaimed. The reclaim process includes severing the electrical connections between the controller die and the semiconductor package substrate without exposing the passive component. In one embodiment, the cutting tool comprises a saw blade. An electrically insulating material is deposited over the exposed bond wires to complete the reclaim process. The reclaimed package and a new controller die are affixed to a second substrate to electrically couple the memory die of the reclaimed package with the new controller die—forming a new package. The new package is encapsulated to form a new memory card.