Company Filing History:
Years Active: 1984-1989
Title: Innovations of Robert T Howard, Jr.
Introduction
Robert T Howard, Jr. is a notable inventor based in Essex Junction, VT (US). He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative processes that enhance the efficiency and effectiveness of semiconductor devices.
Latest Patents
One of Howard's latest patents is the "Lift-off process for terminal metals." This process describes a method for selectively removing unwanted metallization from the surface of a semiconductor device. It involves the deposition of a configurable image defining layer on the device's surface, followed by the application of a pad limiting metallurgy (PLM). The process allows for the melted terminal metal to form a ball on the PLM, significantly reducing the time required for the removal of the polymer mask compared to traditional methods.
Another significant patent is the "Fluxless soldering process using a silane atmosphere." This innovation enables solder reflow or chip joining in a fluxless system by utilizing a carrier gas that contains a specific volume of silane. The preferred carrier gases for this process are hydrogen for solder reflow and nitrogen for chip joining, showcasing Howard's ability to improve soldering techniques in semiconductor manufacturing.
Career Highlights
Robert T Howard, Jr. is currently employed at International Business Machines Corporation (IBM), where he continues to develop and refine his innovative ideas. His work at IBM has positioned him as a key player in advancing semiconductor technology.
Collaborations
Howard has collaborated with notable coworkers such as Stuart E Greer and Herman S Hoffman. These collaborations have likely contributed to the development of his patents and innovations in the field.
Conclusion
Robert T Howard, Jr. is a distinguished inventor whose work in semiconductor technology has led to significant advancements. His innovative patents reflect his commitment to improving manufacturing processes and enhancing device performance.