The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 1987
Filed:
Oct. 31, 1985
Applicant:
Inventor:
Robert T Howard, Jr, Essex Junction, VT (US);
Assignee:
International Business Machines Corp., , NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; H01L / ;
U.S. Cl.
CPC ...
228123 ; 228220 ;
Abstract
Solder reflow or solder chip joining can be accomplished in a fluxless system by conducting the solder reflow or chip joining procedure in a carrier gas which comprises from about 0.1 to about 10% by volume SiH.sub.4, based on the volume of carrier gas and SiH.sub.4. A preferred carrier gas for the reflow is hydrogen and a preferred carrier gas for the chip joining is nitrogen.