Villach, Austria

Robert Rogatschnig

This inventor holds 1 USPTO granted patent. Top assignee: Lam Research Ag. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Robert Rogatschnig. Retrieved from https://idiyas.com/inventor/robert-rogatschnig

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: The Innovations of Robert Rogatschnig

Introduction

Robert Rogatschnig is an accomplished inventor based in Villach, Austria. He is known for his innovative contributions to the field of surface treatment for wafer-shaped articles. With a focus on enhancing processing methods, Rogatschnig has made significant strides in his area of expertise.

Latest Patents

Rogatschnig holds a patent for an "Apparatus for treating surfaces of wafer-shaped articles." This invention features a process chamber and a rotary chuck that operates without physical contact, utilizing a magnetic bearing. The rotary chuck is designed with gripping pins that securely hold wafer-shaped articles in a downward position. Additionally, it includes a rotating plate that protects the upper surfaces of the process chamber from liquids that may be flung off during operation.

Career Highlights

Throughout his career, Rogatschnig has been associated with Lam Research AG, a company renowned for its advanced semiconductor manufacturing equipment. His work has contributed to the development of more efficient and effective methods for processing wafer-shaped articles, which are critical in the semiconductor industry.

Collaborations

Rogatschnig has collaborated with notable colleagues, including Dieter Frank and Andreas Gleissner. Their combined expertise has fostered an environment of innovation and advancement in their field.

Conclusion

Robert Rogatschnig's contributions to the field of wafer processing technology exemplify the spirit of innovation. His patent and work at Lam Research AG highlight his commitment to improving manufacturing processes in the semiconductor industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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