Robert Newman

Title: Innovations by Robert Newman

Introduction

Robert Newman is an accomplished inventor based in San Jose, CA. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique process for controlling the thickness of die attach adhesive.

Latest Patents

Newman's most notable patent is titled "Process for controlling thickness of die attach adhesive." This invention involves a semiconductor die attach adhesive that incorporates a plurality of spacers formed in a suspension of silver-filled glass. In one embodiment, the spacers are designed as spheres. These spacers have a melting temperature that is lower than the temperature at which solvents evaporate from the adhesive. As the solvents are driven from the silver-filled glass during the die attach operation, the spacers partially melt, reducing their thickness. This reduction in thickness decreases the separation between the die and the substrate, effectively preventing the formation of voids within the adhesive. The spacers can be made from a lead/tin alloy, a lead/tin/bismuth alloy, or a lead/tin/bismuth eutectic.

Career Highlights

Robert Newman has been associated with Monolithic Memories, Inc., where he has applied his expertise in semiconductor technology. His innovative approach has contributed to advancements in the industry.

Collaborations

Newman has worked alongside his coworker, Fred M Johnson, to further enhance the development of semiconductor technologies.

Conclusion

Robert Newman is a notable inventor whose work in semiconductor die attach adhesive technology has made a significant impact. His innovative processes continue to influence the field and contribute to advancements in technology.