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For the Inventor, By the Inventor

Jericho, VT, United States of America

Robert M Smith

This inventor holds 13 USPTO granted patents and 1 EPO patent. Top assignees: International Business Machines Corporation, Fmc Technologies, Inc., L3 Technologies, Inc.. Active years: 1997-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Robert M Smith. Retrieved from https://idiyas.com/inventor/robert-m-smith-4i003a6g

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 13

% Patents Active = 84.6


Average Co-Inventor Count = 2.6

ph-index = 5

Forward Citations = 83(Granted Patents)


Location History:

  • Morgan Hill, CA (US) (2001)
  • Jericho, VT (US) (1997 - 2012)
  • Sicklerville, NJ (US) (2017)
  • Erie, PA (US) (2014 - 2024)
  • Marlette, MI (US) (2023 - 2024)

Company Filing History:

goldMedal8 out of 166,325 
 
International Business Machines Corporation
 patents
silverMedal2 out of 469 
 
Fmc Technologies, Inc.
 patents
bronzeMedal1 out of 77 
 
L3 Technologies, Inc.
 patents
where one patent can have more than one assignee

Years Active: 1997-2024

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13 patents (USPTO):Explore Patents
1. 11912111 - Vehicle cover assembly (2024-02-27),
2. 11902373 - Smart meter block (2024-02-13),
3. D983121 - Vehicle cover assembly (2023-04-11),
4. 9760731 - Configurable cross-domain information assurance (2017-09-12),
5. 8770041 - Rotational measurement system for fluid meters (2014-07-08),
6. 8134225 - Quad flat no-lead chip carrier with standoff (2012-03-13),
7. 7405106 - Quad flat no-lead chip carrier with stand-off (2008-07-29),
8. 6603195 - Planarized plastic package modules for integrated circuits (2003-08-05),
9. 6428300 - Ultra mold for encapsulating very thin packages (2002-08-06),
10. 6332168 - Method of, system for, and computer program product for providing a run time subsystem for run time libraries (2001-12-18),
11. 6306331 - Ultra mold for encapsulating very thin packages (2001-10-23),
12. 5776801 - Leadframe having contact pads defined by a polymer insulating film (1998-07-07),
13. 5608260 - Leadframe having contact pads defined by a polymer insulating film (1997-03-04),

Title: The Innovative Journey of Robert M Smith

Introduction: Robert M Smith, a pioneering inventor based in Jericho, VT (US), has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Robert M Smith's latest patents include cutting-edge technologies in the fields of renewable energy, artificial intelligence, and sustainable agriculture, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: With a career spanning over two decades, Robert M Smith has established himself as a leading figure in the world of inventions. His innovative solutions have not only revolutionized industries but have also improved the quality of life for many around the globe.

Collaborations: Throughout his career, Robert M Smith has collaborated with top research institutions, universities, and leading companies to bring his inventions to life. His ability to work in multidisciplinary teams has led to the development of groundbreaking technologies that have had a lasting impact on society.

Conclusion: In conclusion, Robert M Smith's passion for innovation, coupled with his dedication to pushing the boundaries of what is possible, has solidified his reputation as a visionary inventor. His contributions to the world of technology continue to inspire future generations of inventors to think outside the box and create a better tomorrow.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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