The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2003
Filed:
Jun. 28, 2000
David V. Caletka, Apalachin, NY (US);
James L. Carper, Colchester, VT (US);
John P. Cincotta, Essex Junction, VT (US);
Kibby B. Horsford, Essex, VT (US);
Gary H. Irish, Jericho, VT (US);
John J. Lajza, Jr., Essex Junction, VT (US);
Gordon C. Osborne, Jr., Essex Junction, VT (US);
Charles R. Ramsey, Essex Junction, VT (US);
Robert M. Smith, Jericho, VT (US);
Michael J. Vadnais, George, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.