Bloomington, MN, United States of America

Robert M Lufkin


Average Co-Inventor Count = 7.0

ph-index = 2

Forward Citations = 91(Granted Patents)


Company Filing History:


Years Active: 1998-1999

Loading Chart...
2 patents (USPTO):Explore Patents

Title: The Innovations of Robert M. Lufkin

Introduction

Robert M. Lufkin, an influential inventor based in Bloomington, Minnesota, holds a remarkable portfolio of two patents in the field of multilayer substrates. His innovative work has significantly advanced the technology and applications of electronic packaging.

Latest Patents

Lufkin's latest inventions focus on laminated multilayer substrates. His first patent details a multilayer package that encompasses multiple interconnected large-layer-count (LLC) substrates. Each LLC substrate features conductive pads on both its top and bottom surfaces, connecting through vias containing conductive material. Lufkin's design ensures that the posts on the pads interconnect and are electrically bonded, all while being mechanically secured with a non-flowable adhesive film that also accommodates the substrate posts. The second patent outlines a process for laminating LLC substrates, which involves forming vias through the respective substrates and creating conductive paths. The posts are aligned to confront each other, facilitating both mechanical bonding and electrical connection through a non-flowable adhesive layer.

Career Highlights

Throughout his career, Robert Lufkin has made significant contributions while working for reputable organizations such as General Dynamics Information Systems. His roles at these companies have provided him with a strong foundation in electronic systems and innovations.

Collaborations

Lufkin had the opportunity to collaborate with esteemed professionals in his field, including Deepak Keshav Pai and Ronald R. Denny. These collaborations have enriched his inventiveness and contributed to the successful outcome of his patents.

Conclusion

Robert M. Lufkin exemplifies the spirit of innovation through his patents in laminated multilayer substrates. His career achievements and collaborations highlight the importance of teamwork in the realm of invention. As technology continues to evolve, Lufkin's contributions will undoubtedly play a pivotal role in shaping future advancements in electronic packaging.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…