The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 1999

Filed:

Jul. 14, 1998
Applicant:
Inventors:

Deepak K Pai, Burnsville, MN (US);

Ronald R Denny, Brooklyn Center, MN (US);

Jeanne M Chevalier, Savage, MN (US);

George F Schwartz, III, Hopkins, MN (US);

Clark F Webster, Northfield, MN (US);

Robert M Lufkin, Bloomington, MN (US);

Terrance A Krinke, Roseville, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257700 ; 257758 ; 257686 ; 257774 ; 257723 ; 257730 ;
Abstract

A multilayer package includes a plurality of interconnected large-layer-count (LLC) substrates. The LLC substrates each include conductive pads on the top and bottom surfaces of the substrate, a via in the substrate including conductive material to contact the pads on the top and bottom surfaces, and a post on a pad over the via. The posts of the substrates confront and abut each other, and are electrically bonded together. A non-flowable adhesive film mechanically bonds the LLC substrates, and has an aperture receiving the posts of the substrates.


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