The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 1998
Filed:
Feb. 13, 1997
Deepak K Pai, Burnsville, MN (US);
Ronald R Denny, Brooklyn Center, MN (US);
Jeanne M Chevalier, Savage, MN (US);
George F Schwartz, III, Hopkins, MN (US);
Clark F Webster, Northfield, MN (US);
Robert M Lufkin, Bloomington, MN (US);
Terrance A Krinke, Roseville, MN (US);
Generyal Dynamics Information Systems, Inc., Falls Church, VA (US);
Abstract
A process of laminating a large-layer-count (LLC) substrates includes formation of first and second vias through respective substrates. A conductive path is formed through each of the respective vias, and posts are formed on the respective vias, electrically connected to the respective conductive path. A non-flowable adhesive layer having an aperture is provided between the LLC substrates so that the posts confront each other through the aperture. The LLC substrates are pressed together through the non-flowable adhesive layer to mechanically bond them together, and so that the posts abut each other. Simultaneously, the posts are electrically bonded to each other in the aperture.