Robert L Hubbard

Title: The Innovative Contributions of Robert L Hubbard

Introduction

Robert L Hubbard is a notable inventor based in Tempe, AZ (US), recognized for his significant contributions to technology through his innovative patents. With a total of 5 patents, Hubbard has made strides in the field of conductive materials and packaging technologies.

Latest Patents

Hubbard's latest patents include groundbreaking inventions such as "Resonating conductive traces and methods of using same for bonding components." This patent describes conductive traces and patterns that bond components together using electromagnetic radiation. Each trace is designed to resonate and heat up when exposed to specific wavelengths of electromagnetic radiation, such as microwave or RF energy. This technology allows for uniform heating of target areas on substrates or other components.

Another significant patent is the "Stacked die package," which involves stiffening a flexible substrate and arranging a chip mounting pattern on one side. Chips are mounted according to this pattern, and a solder ball array on the opposite side is routed to the chips. The flexible substrate and stiffener are then folded to align the chips in the stacked die package, with the stiffener being removed by a single saw cut.

Career Highlights

Throughout his career, Robert L Hubbard has worked with prominent companies such as Medtronic, Inc. and Lambda Technologies, Inc. His experience in these organizations has contributed to his expertise in developing innovative technologies.

Collaborations

Hubbard has collaborated with talented individuals, including coworkers Juan G Milla and Zakaryae Fathi, who have contributed to his projects and innovations.

Conclusion

Robert L Hubbard's inventive spirit and dedication to technology have led to significant advancements in conductive materials and packaging solutions. His patents reflect a commitment to innovation that continues to impact the industry.