The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2006
Filed:
Jun. 18, 2003
Robert L. Hubbard, Mesa, AZ (US);
Juan G. Milla, Mesa, AZ (US);
Robert L. Hubbard, Mesa, AZ (US);
Juan G. Milla, Mesa, AZ (US);
Medtronic, Inc., Minneapolis, MN (US);
Abstract
A method for forming a high voltage component package, which includes providing a flexible non-conductive substrate, forming a conductive layer on the substrate, and forming a circuit trace from the conductive layer, the circuit trace having frangible leads. A first side of a component overlies at least a portion of the circuit trace, and the component is coupled to the circuit trace by breaking a frangible lead on the trace and bonding the lead to the component. The flexible substrate is then bent or folded such that another portion of the circuit trace is in proximity to a second side of the component. The trace is coupled to the second side of the component either with a conductive adhesive or by bonding with another frangible trace.