Company Filing History:
Years Active: 1988
Title: The Innovations of Robert L. Comstock
Introduction
Robert L. Comstock is a notable inventor based in Santa Clara, CA (US). He has made significant contributions to the field of integrated circuits, holding a total of 2 patents. His work has had a lasting impact on semiconductor technology and manufacturing processes.
Latest Patents
One of Comstock's latest patents is the "Integrated circuit die-to-lead frame interconnection assembly and method." This invention addresses the challenges of bonding wire sag and high lead counts by introducing an insulative bridging member. This member connects the ends of inner leads of a lead frame to a centrally mounted integrated circuit die, ensuring reliable connections. Another significant patent is the "Apparatus and method for testing coplanarity of semiconductor components." This method involves measuring the alignment of leads on the perimeter of a surface mount device using a beam of light, allowing for precise determination of lead alignment.
Career Highlights
Throughout his career, Comstock has worked with several prominent companies, including Monolithic Memories, Inc. and Santana Engineering Systems. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.
Collaborations
Comstock has collaborated with notable individuals in the field, including Steven L. Baburek and Michael R. Hansen. These partnerships have further enriched his work and contributions to the industry.
Conclusion
Robert L. Comstock's innovations in integrated circuit technology have paved the way for advancements in semiconductor manufacturing. His patents reflect a deep understanding of the challenges in the field and offer practical solutions that continue to influence the industry today.