Monolithic Memories, Inc.

Santana Engineering Systems

Tamarack Biotics LLC

Robert L Comstock

Steven L Baburek

Michael R Hansen

Edrick H Tong

In order to prevent bonding wire sag and to allow high lead count an insulative bridging member is provided between the ends of inner leads of a lead frame and a centrally mounted integrated circuit die. The bridging member of annular square configuration has transverse plated spaced conductive pathways. A first series of short bonding wires connect selected die contact pads to an inner end of selected conductive pathways and a second concentric series of bonding wires connect an outer end of the selective conductive pathways of the bridging member to selected ones of the inner leads of the lead frame. The above elements except for outer leads of the lead frame are encapsulated to form an overall die package with external leads or pin contacts.

Integrated circuit die-to-lead frame interconnection assembly and method

A method and apparatus for measuring the alignment of leads along the perimeter of an integrated circuit surface mount device (SMD). The device is placed so that a first lead is within the path of a beam of light emitted from a light source. The light source is moved around the perimeter of the device so that the beam of light contacts all of the leads of the device. The angle of reflection of the beam of light off of each of the leads is detected. From this angle, the alignment of the leads is determined by first calculating a seating plane and then calculating the variation of each lead from the seating plane.

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Santa Clara, CA, United States of America

Robert L Comstock