Robert Jordan

Title: The Innovations of Robert Jordan

Introduction

Robert Jordan is an accomplished inventor based in Portland, Oregon. He has made significant contributions to the field of electronic packaging, particularly through his innovative patent. His work focuses on enhancing the performance and reliability of electronic devices.

Latest Patents

Jordan holds a patent for a "Dielectric film coating for through glass vias and plane surface roughness mitigation." This invention includes embodiments that describe electronic packages comprising a substrate made of glass. The patent details a via opening through the substrate, where the sidewalls exhibit a root mean squared (RMS) surface roughness of approximately 100 nm or greater. Additionally, the electronic package features a liner over the sidewalls of the via opening, with an RMS surface roughness of approximately 50 nm or smaller. This innovation aims to improve the overall performance of electronic packages.

Career Highlights

Throughout his career, Robert Jordan has been associated with Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has allowed him to contribute to cutting-edge technologies that shape the future of electronics.

Collaborations

Jordan has collaborated with Telesphor Kamgaing, a fellow innovator in the field. Their partnership has fostered a creative environment that encourages the development of new ideas and solutions in electronic packaging.

Conclusion

Robert Jordan's contributions to the field of electronic packaging