Robert J Ringhofer

Title: The Innovations of Robert J Ringhofer

Introduction

Robert J Ringhofer is an accomplished inventor based in Boise, ID (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of die trimming methods. His innovative approach has led to advancements that enhance the performance and yield of non-volatile memory devices.

Latest Patents

Robert J Ringhofer holds a patent for a method titled "Die based trimming." This patent describes methods and structures that provide trims for die on a wafer. The unique aspect of this invention is that the trims are set on a die-by-die basis instead of a wafer basis. This allows for more precise tuning of individual die, resulting in improved operational specifications and increased yield. In one embodiment, the odd and even blocks of each non-volatile memory die are erased and programmed to test the program time. Statistical analysis of the tested program times is then performed, leading to the determination of trim values that are programmed into each die. Consequently, each die on a wafer has its individual trim settings.

Career Highlights

Robert is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His work focuses on enhancing the efficiency and effectiveness of memory devices through innovative trimming techniques. His contributions have been instrumental in advancing the capabilities of non-volatile memory technologies.

Collaborations

Robert has collaborated with notable colleagues such as Scott N Gatzemeier and Joemar Sinipete. These collaborations have fostered a productive environment for innovation and have contributed to the success of their projects.

Conclusion

Robert J Ringhofer's work exemplifies the spirit of innovation in the semiconductor industry. His patented methods for die trimming have the potential to significantly improve the performance of memory devices, showcasing his valuable contributions to technology.