Company Filing History:
Years Active: 2017-2019
Title: The Innovations of Robert J Hayes
Introduction
Robert J Hayes is a notable inventor based in Portland, OR (US). He has made significant contributions to the field of integrated circuit technology. With a total of 2 patents, his work focuses on enhancing the functionality and efficiency of protocol stacks in integrated circuits.
Latest Patents
Hayes' latest patents include a method, apparatus, and system for configuring a protocol stack of an integrated circuit chip. This innovation involves techniques and mechanisms that allow an integrated circuit (IC) chip to implement a protocol stack effectively. In one embodiment, the transaction layer of the IC chip is designed to exchange transaction layer packets (TLPs) with the link layer, adhering to the specifications defined in the Peripheral Component Interconnect Express™ (PCIe™) standard. The configuration circuitry of the IC chip enables the setup of a first protocol stack, which includes the transaction layer, link layer circuitry, and a first physical layer. Additionally, it allows for an alternative configuration of a second protocol stack, which also includes the transaction layer, link layer circuitry, and a second physical layer. Notably, the first protocol stack supports single-ended signaling for TLP communication, while the second protocol stack utilizes differential signaling.
Career Highlights
Robert J Hayes is currently employed at Intel Corporation, where he continues to innovate and develop advanced technologies. His work at Intel has positioned him as a key player in the field of integrated circuits.
Collaborations
Hayes has collaborated with notable colleagues, including Bryan L Spry and Marcus W Song. These partnerships have contributed to the advancement of his projects and innovations.
Conclusion
Robert J Hayes exemplifies the spirit of innovation in the field of integrated circuits. His patents and work at Intel Corporation highlight his commitment to advancing technology. His contributions are significant in shaping the future of integrated circuit design and functionality.