Robert J Falcone

Title: Innovations of Robert J. Falcone

Introduction

Robert J. Falcone is a notable inventor based in Odessa, Texas. He has made significant contributions to the field of electronics, particularly in semiconductor packaging. With a total of 3 patents to his name, Falcone's work has had a considerable impact on the industry.

Latest Patents

One of his latest patents is for a hybrid chip carrier package. This electronic device features a rectangular ceramic package structure with an interior cavity that extends to an opening. It includes a semiconductor die, a lid that seals the cavity, and conductive terminals that are electrically coupled to the circuit of the semiconductor die. Another significant patent is a method to produce known good die using temporary wire bond and die attach. This method allows for the temporary packaging of a semiconductor die, enabling it to be tested and removed without damage. The innovative approach utilizes a reverse bonding process and a specially designed wedge tool to ensure the integrity of the die during the packaging process.

Career Highlights

Robert J. Falcone is currently employed at Texas Instruments Corporation, a leading company in the semiconductor industry. His work at Texas Instruments has allowed him to develop and refine his innovative ideas, contributing to the advancement of technology in electronic devices.

Collaborations

Throughout his career, Falcone has collaborated with notable coworkers such as Timothy J. Hogan and Stephen R. Martin. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.

Conclusion

Robert J. Falcone's contributions to the field of electronics through his patents and work at Texas Instruments Corporation highlight his role as a significant inventor. His innovative approaches to semiconductor packaging continue to influence the industry and pave the way for future advancements.