Method to produce known good die using temporary wire bond, die attach

Abstract

A method for temporarily packaging a semiconductor die, includes attaching the semiconductor die (40) to a die support (60) in a cavity (58) of package housing (56) with an adhesive (52) that will cures at a first low temperature and volatilizes at a second, higher temperature that is less than the temperature that will drive diffusions in the die deeper and change the electrical characteristics of the die. A reverse bonding process is used to form a first wedge bond with a relatively soft wire (88) on a conductive pad (62) extending into cavity (58) and a second wedge bond on a bond pad (41) on die (40). The wedge tool (76) used to make the wedge bonds has a front radius which is larger than that on conventional wedge tools, so that the cross-sectional area of the bond heel (91) is increased. The increased cross-sectional area and soft wire permit the wire to be removed from the bond pad (41) without breaking the wire or significantly damaging the bond pad. Die 40 may be burned-in or tested following bonding by placing the package housing (56) in a tester. The wire (88) is then pulled to break the wedge bond on bond pad (41) and adhesive (52) exposed to the second temperature to volatilize the adhesive to permit the die (40) to be picked up from the die support (60). This temporary packaging method permits die to be packaged, tested, and removed from the package without damaging them.