Company Filing History:
Years Active: 2000-2003
Title: The Innovations of Robert J Durante
Introduction
Robert J Durante is a notable inventor based in Parma Heights, Ohio, with a focus on advancements in copper surface technology. He holds a total of 4 patents, showcasing his contributions to the field of materials science and engineering. His work primarily revolves around improving bonding properties of copper surfaces, which is crucial in various applications, including electronics.
Latest Patents
One of Durante's latest patents is titled "Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom." This invention outlines a method for preparing a substrate that can achieve a cocontinuous bond. The process involves several steps, including obtaining a copper or copper alloy substrate and applying an etching composition that contains an acid, an oxidizing agent, a copper complexing agent, and a copper complex. The invention also details the treatment of the substrate with a coating composition and the application of a stripping composition. The result is a microporous copper or copper alloy substrate that exhibits enhanced adhesion properties to organic materials, making it particularly useful for multilayer articles such as printed circuit boards.
Career Highlights
Durante has made significant strides in his career, working with reputable companies such as Atotech Deutschland GmbH and McGean-Rohco, Inc. His experience in these organizations has allowed him to refine his expertise in materials and surface treatments, contributing to his innovative patent portfolio.
Collaborations
Durante has collaborated with notable professionals in his field, including Craig V Bishop and John R Kochilla. These partnerships have likely enriched his work and led to further advancements in his research and inventions.
Conclusion
Robert J Durante's contributions to the field of copper surface technology are noteworthy, with his innovative methods enhancing the bonding capabilities of copper materials. His patents reflect a commitment to improving industrial applications and advancing materials science.