Robert Edgar Davis

Title: The Innovations of Robert Edgar Davis

Introduction

Robert Edgar Davis is a notable inventor based in Fishkill, NY (US). He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to thru-silicon-via technology. His work has implications for the advancement of electronic devices and their manufacturing processes.

Latest Patents

Davis holds a patent for an "Edge seal for thru-silicon-via technology." This invention involves the formation of multilayer back side metallurgy (BSM) stack structures on thru-silicon-vias (TSV). The patent details a method where multiple layers of metal are utilized, including an adhesion layer of chromium, a conductive layer of copper, a diffusion barrier layer of nickel, and a layer of noble metal such as gold. The design aims to prevent edge attack of copper after dicing by sealing the copper edge with nickel and further protecting the nickel layer with gold.

Career Highlights

Davis is associated with the International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to explore and develop advanced technologies that enhance the performance and reliability of semiconductor devices. His patent reflects his expertise and commitment to innovation in this critical field.

Collaborations

Throughout his career, Davis has collaborated with esteemed colleagues, including Robert Daniel Edwards and J Edwin Hostetter. These collaborations have likely contributed to the successful development of his patented technologies and have fostered a culture of innovation within their work environment.

Conclusion

Robert Edgar Davis is a distinguished inventor whose contributions to semiconductor technology are noteworthy. His patent for edge sealing in thru-silicon-via technology exemplifies his innovative spirit and dedication to advancing electronic manufacturing processes.