The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2011
Filed:
Dec. 04, 2007
Robert Edgar Davis, Fishkill, NY (US);
Robert Daniel Edwards, Marlboro, NY (US);
J. Edwin Hostetter, Jr., Pleasant Valley, NY (US);
Ping-chuan Wang, Hopewell Junction, NY (US);
Kimball M. Watson, Essex Junction, VT (US);
Robert Edgar Davis, Fishkill, NY (US);
Robert Daniel Edwards, Marlboro, NY (US);
J. Edwin Hostetter, Jr., Pleasant Valley, NY (US);
Ping-Chuan Wang, Hopewell Junction, NY (US);
Kimball M. Watson, Essex Junction, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
One or more multilayer back side metallurgy (BSM) stack structures are formed on thru-silicon-vias (TSV). The multiple layers of metal may include an adhesion layer of chromium on the semiconductor wafer back side, a conductive layer of copper, diffusion barrier layer of nickel and a layer of nobel metal, such as, gold. To prevent edge attack of copper after dicing, the layer of nickel is formed to seal the copper edge. To also prevent edge attack of the layer of nickel after dicing, the layer of gold is formed to seal both the layer of copper and the layer of nickel.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile