Robert Dale Ickes, Jr

Title: The Innovations of Robert Dale Ickes, Jr.

Introduction

Robert Dale Ickes, Jr. is an accomplished inventor based in Blandon, PA (US). He has made significant contributions to the field of electronic testing, particularly with his innovative methods for testing electronic wafers. His work has implications for improving the reliability and efficiency of electronic devices.

Latest Patents

Ickes holds a patent for a "Method of testing electronic wafers having lead-free solder contacts." This invention introduces a cantilever probe method for parametrically testing wafers. It extends the probe tip cleaning interval, maintains relatively low contact resistance, and reduces contact resistance variability. The method involves exposing terminals to a plasma containing oxygen and utilizing cantilevered probes designed to eliminate sliding movement during contact. This innovative approach enhances the testing process for electronic circuits formed in wafers with lead-free terminals.

Career Highlights

Robert Dale Ickes, Jr. is associated with Agere Systems Inc., where he has applied his expertise in electronic testing. His work has contributed to advancements in the industry, particularly in the realm of lead-free solder technology. His patent reflects his commitment to improving electronic testing methodologies.

Collaborations

Ickes has collaborated with notable coworkers such as Brian Lee Buss and Wayne Rademacher. Their combined efforts have fostered innovation and development within their field.

Conclusion

Robert Dale Ickes, Jr. is a notable inventor whose contributions to electronic testing have paved the way for advancements in the industry. His innovative methods continue to influence the development of reliable electronic devices.