Company Filing History:
Years Active: 2007-2020
Title: The Innovative Contributions of Robert Bauer
Introduction
Robert Bauer is a notable inventor based in Moosach, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and reliability of semiconductor devices.
Latest Patents
One of Robert Bauer's latest patents is titled "Semiconductor devices and methods for forming a semiconductor device." This invention includes an electrically conductive contact pad structure and a bond structure that is in contact with the contact pad at an enclosed interface region. Additionally, it features a degradation prevention structure that surrounds the enclosed interface region, ensuring the longevity and performance of the semiconductor device.
Another significant patent is "Chip arrangement, and method for forming a chip arrangement." This invention describes a chip that includes a plurality of electrical nets, each with at least one bonding pad. The design incorporates a plurality of pillars that connect the bonding pads to a chip-external connection region, facilitating better connectivity and functionality.
Career Highlights
Robert Bauer is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His role involves developing innovative technologies that push the boundaries of what is possible in the semiconductor industry.
Collaborations
Throughout his career, Robert has collaborated with talented individuals such as Werner Ertle and Till Frohnmüller. These collaborations have contributed to the advancement of semiconductor technologies and have fostered a creative environment for innovation.
Conclusion
Robert Bauer's contributions to semiconductor technology through his patents and collaborations highlight his importance in the field. His work continues to influence the development of efficient and reliable semiconductor devices.