The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2007
Filed:
Jun. 12, 2003
Robert Bauer, Moosach, DE;
Werner Ertle, Neubiberg, DE;
Till Frohnmüller, München, DE;
Bernd Goller, Otterfing, DE;
Reinhard Greiderer, München, DE;
Oliver Nagler, München, DE;
Olaf Schmeckebier, München, DE;
Wolfgang Stadler, München, DE;
Robert Bauer, Moosach, DE;
Werner Ertle, Neubiberg, DE;
Till Frohnmüller, München, DE;
Bernd Goller, Otterfing, DE;
Reinhard Greiderer, München, DE;
Oliver Nagler, München, DE;
Olaf Schmeckebier, München, DE;
Wolfgang Stadler, München, DE;
Infineon Technologies AG, , DE;
Abstract
An integrated semiconductor structure has a substrate, a semiconductor element located on the substrate, a pad metal, metal layers located between the pad metal and the substrate, and insulation layers that separate the metal layers from one another. The pad metal extends over at least—part of the semiconductor element. Below the surface of the pad metal, at least the top two metal layers include two or more adjacent interconnects.