Robert A Tuerck

Title: Innovations of Robert A Tuerck

Introduction

Robert A Tuerck is a notable inventor based in Garland, TX (US). He has made significant contributions to the field of integrated circuit technology, holding a total of 2 patents. His work focuses on enhancing the reliability and manufacturability of IC packages.

Latest Patents

Tuerck's latest patents include an "Embedded scribe lane crack arrest structure for improved IC package reliability of plastic flip chip devices." This invention addresses the issue of cracks in the wafer dicing process by embedding a crack arrest structure (CAS) between adjacent scribe lanes. The CAS acts as a moisture diffusion block and absorbs energy from cracks, thereby protecting the die seals without increasing the width of the scribe lanes.

Another significant patent is the "Method for optimizing the integrated circuit chip size for efficient manufacturing." This invention optimizes the number of good IC chips per wafer by examining various chip-to-wafer offsets and reticle exposure arrangements. The integration of shot map optimization and frame generation allows for the creation of an optimal shot map, providing valuable insights into the impact of chip size on manufacturability.

Career Highlights

Robert A Tuerck is currently employed at Texas Instruments Corporation, where he continues to innovate in the field of integrated circuits. His work has contributed to advancements in manufacturing processes and product reliability.

Collaborations

Tuerck has collaborated with notable coworkers such as Jeffrey Alan West and Patricia Vincent, further enhancing the innovative environment at Texas Instruments Corporation.

Conclusion

Robert A Tuerck's contributions to integrated circuit technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the challenges in the industry and provide solutions that enhance both reliability and efficiency.