The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2012
Filed:
Feb. 04, 2009
Jeffrey A. West, Dallas, TX (US);
Patricia Diane Vincent, Prosper, TX (US);
Robert A. Tuerck, Garland, TX (US);
Jeffrey A. West, Dallas, TX (US);
Patricia Diane Vincent, Prosper, TX (US);
Robert A. Tuerck, Garland, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A system, method, and apparatus for suppressing cracks in the wafer dicing process. A wafer includes a plurality of die attached to a frame and mounting tape, with the die separated by a plurality of scribe lanes. An existing die seal generally protects the boundary of the die but can still fail to fully protect the die from excessive cracks induced by dicing damage, particularly when dicing through brittle, low-k dielectrics. The system, method, and apparatus includes embedding a crack arrest structure (CAS) between adjacent scribe lanes. Upon a mechanical saw dicing the wafer, the CAS creates a moisture diffusion block, and can absorb or significantly diminish the energy of cracks propagating towards the individual die seals. Furthermore, the system, method, and apparatus can be implemented without the need to increase the width of the scribe lanes.