This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Denso Corporation. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Riku Onishi - Innovator in Semiconductor Manufacturing
Introduction
Riku Onishi is a notable inventor based in Kariya, Japan. He has made significant contributions to the field of semiconductor manufacturing. His innovative approach has led to the development of a unique method for producing semiconductor wafers.
Latest Patents
Riku Onishi holds 1 patent for his invention titled "Method of manufacturing semiconductor wafers." This patent describes a manufacturing method that involves preparing an ingot with a peeling layer formed along its first major surface. The process includes applying a load to the ingot to facilitate the peeling of a wafer precursor, which is crucial for semiconductor production.
Career Highlights
Riku Onishi is currently employed at Denso Corporation, a leading company in the automotive and technology sectors. His work at Denso has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in semiconductor technology.
Collaborations
Throughout his career, Riku has collaborated with talented individuals such as Sodai Nomura and Tomoki Kawazu. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Riku Onishi's contributions to semiconductor manufacturing exemplify the spirit of innovation. His patented method showcases his expertise and commitment to advancing technology in this critical field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile