Rih-Sin Jian

Title: Rih-Sin Jian: Innovator in High-Current Printed Circuit Board Technology

Introduction

Rih-Sin Jian is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of printed circuit board technology, holding 2 patents that showcase his innovative methods and designs.

Latest Patents

One of Rih-Sin Jian's latest patents is a method for manufacturing a high-current printed circuit board. This method involves providing a circuit substrate that includes a substrate layer, a first circuit layer, and a second circuit layer. The first conductive circuits on the first circuit layer have a greater line width than the second conductive circuits on the second circuit layer. Additionally, buffering circuits are formed by plating, which electrically connects the first circuit layer to the second circuit layer, ensuring efficient current flow. Another patent focuses on a printed circuit board that comprises a circuit substrate and multiple buffering circuits, emphasizing the importance of line width in enhancing electrical connectivity.

Career Highlights

Rih-Sin Jian has worked with several companies throughout his career, including Avary Holding (Shenzhen) Co., Limited and Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd. His experience in these organizations has contributed to his expertise in the field of electronics and circuit board manufacturing.

Collaborations

Rih-Sin Jian has collaborated with notable coworkers such as Xiao-Wei Kang and Yang Liu. Their joint efforts have likely fostered innovation and advancements in their respective projects.

Conclusion

Rih-Sin Jian's contributions to high-current printed circuit board technology reflect his dedication to innovation and excellence in the field. His patents and career achievements highlight his role as a significant inventor in the electronics industry.