Rick Lee Mangold

Title: Rick Lee Mangold and His Flip-Chip Solder-Bump Patent

Introduction

Rick Lee Mangold is an inventor associated with Lake Worth, Florida, and Motorola Corporation. His patent work addresses a manufacturing process for forming solder bumps used in flip-chip integrated circuits.

Latest Patents

The provided information identifies one patent associated with Mangold: “Process for Fabricating a Solder Bump for a Flip Chip Integrated Circuit.” The invention describes evaporatively depositing a first metallization system to create an elongated post on an integrated circuit’s die pad, extending beyond the die pad window over the passivation layer. A second metallization system is then deposited to form a cap. When reflowed, the post and cap form a eutectic solder bump with improved geometry. Mangold is credited with 1 patent.

Career Highlights

Mangold’s documented patent contribution focuses on improving the geometry and fabrication of solder bumps for flip-chip integrated circuits. The process uses separately formed post and cap structures that combine during reflow.

Collaborations

The supplied information lists James George Lance, Jr. as Mangold’s coworker. It does not specify whether Lance collaborated on the patent or describe their professional roles.

Conclusion

Rick Lee Mangold’s recorded invention concerns a structured metallization process for producing improved solder bumps in flip-chip integrated circuits, reflecting his patent-related work associated with Motorola Corporation.