Richard W Wensel

This inventor holds 41 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Micron Technology Incorporated, Micro Technology, Inc.. Active years: 1999-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard W Wensel. Retrieved from https://idiyas.com/inventor/richard-w-wensel

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 41

% Patents Active = 82.9

Average Co-Inventor Count = 1.2

ph-index = 10

Forward Citations = 311(Granted Patents)

Company Filing History:

40 out of 39,222

Micron Technology Incorporated

patents

1 out of 59

Micro Technology, Inc.

patents

Years Active: 1999-2008

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Areas of Expertise:

Transfer Molding

Semiconductor Packaging

Heat Sink

Ball Grid Arrays

Microelectronic Components

Chip-on-Board Assemblies

Gate Break

Encapsulation

BGA Warpage

Leadframe Bonding

Oxide Surface

Contaminant Removal

41 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7384805 - Transfer mold semiconductor packaging processes (2008-06-10),

2. 7148083 - Transfer mold semiconductor packaging processes (2006-12-12),

3. 7095115 - Circuit substrates, semiconductor packages, and ball grid arrays (2006-08-22),

4. 7061082 - Semiconductor die with attached heat sink and transfer mold (2006-06-13),

5. 6921860 - Microelectronic component assemblies having exposed contacts (2005-07-26),

6. 6869811 - Methods for transfer molding encapsulation of a semiconductor die with attached heat sink (2005-03-22),

7. 6734372 - Gate area relief strip for a molded I/C package (2004-05-11),

8. 6707165 - Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device (2004-03-16),

9. 6677681 - Carrier substrate and carrier assembly using residual organic compounds to facilitate gate break (2004-01-13),

10. 6664646 - Chip-on-board assemblies, carrier assemblies and carrier substrates using residual organic compounds to facilitate gate break (2003-12-16),

11. 6583504 - Semiconductor die with attached heat sink and transfer mold (2003-06-24),

12. 6576057 - Method and apparatus for application of spray adhesive to a leadframe for chip bonding (2003-06-10),

13. 6555898 - Dam structure for center-bonded chip package (2003-04-29),

14. 6555412 - Packaged semiconductor chip and method of making same (2003-04-29),

15. 6545368 - Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device (2003-04-08),

Title: Richard W. Wensel: Innovator in Semiconductor Packaging Technology

Introduction

Richard W. Wensel is a distinguished inventor based in Boise, ID, known for his remarkable contributions to the field of semiconductor packaging. With a total of 41 patents to his name, Wensel has significantly advanced technology, particularly in transfer mold semiconductor packaging processes. His inventions have played a vital role in enhancing the efficiency and reliability of electronic devices.

Latest Patents

One of Wensel's latest patents focuses on transfer mold semiconductor packaging processes. This invention involves a circuit substrate with opposing sides, where at least one side is designed for transfer mold packaging. The substrate features conductive traces, and a soldermask is applied with multiple openings aligned with these traces. Notably, the soldermask includes a peripheral elongated trench that positions correctly with the perimeter of a transfer mold, providing a robust solution for semiconductor packaging. His developments include critical elements such as semiconductor packages and ball grid arrays, which are essential for modern electronic architecture.

Career Highlights

Throughout his career, Richard has made significant strides in the semiconductor industry, particularly during his tenure at reputable companies such as Micron Technology Incorporated and Micro Technology, Inc. His expertise in the field has not only led to numerous patents but has also positioned him as a thought leader in semiconductor innovation.

Collaborations

Wensel has worked alongside notable professionals in the industry, including coworkers Scott Gooch and Larry Duane Kinsman. Their collaborations have fostered an environment of innovation, leading to various patent developments that have contributed to the evolution of semiconductor technologies.

Conclusion

In summary, Richard W. Wensel's impact on semiconductor packaging technology is significant and far-reaching. With 41 patents to his name, he continues to pave the way for advancements in the field, highlighting the importance of innovation in the ever-evolving landscape of technology. His work stands as a testament to the critical role inventors play in shaping the future of electronic devices.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]