The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2005

Filed:

Mar. 18, 2003
Applicants:

Darin L. Peterson, Boise, ID (US);

Richard W. Wensel, Boise, ID (US);

Choon Kuan Lee, Singapore, SG;

James A. Faull, Boise, ID (US);

Inventors:

Darin L. Peterson, Boise, ID (US);

Richard W. Wensel, Boise, ID (US);

Choon Kuan Lee, Singapore, SG;

James A. Faull, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L023/552 ;
U.S. Cl.
CPC ...
Abstract

The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component includes an array of spaced-apart dams, each of which is associated with and circumscribes an open contact volume associated with one of the contacts. A dielectric material may cover the portion of the microelectronic component active surface that is external to the dams and extend between the spaced-apart dams.


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