This inventor holds 2 USPTO granted patents. Top assignees: Pq Corporation, Valtech Corporation. Active years: 1987-1990.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1987-1990
Title: Richard T Girard: Innovator in Semiconductor Technology
Introduction
Richard T Girard is a notable inventor based in Coventryville, PA (US). He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to improving semiconductor wafer preparation.
Latest Patents
Girard's latest patents include a method for preparing semiconductor wafers, which introduces profound improvements in the process of cutting semiconductor ingots. This method utilizes an adhesive containing hollow microspheres to bond the ingot to a mounting or cutting beam. Another significant patent is for a self-dressing mounting beam designed for slicing wafers from ingots of various materials, particularly semiconductors. This mounting beam is composed of a composite material that includes an organic polymer, abrasive particles, and hollow microspheres. The design allows the saw to penetrate both the mounting beam and the ingot, ensuring that the self-dressing feature is activated with each pass of the blade.
Career Highlights
Throughout his career, Richard T Girard has worked with several companies, including Valtech Corporation and Pq Corporation. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.
Collaborations
Girard has collaborated with various professionals in his field, including his coworker John R McLaughlin. Their joint efforts have further advanced the development of semiconductor technologies.
Conclusion
Richard T Girard's contributions to semiconductor technology through his patents and career experiences highlight his role as an innovator in the field. His work continues to influence advancements in the preparation of semiconductor wafers.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
