The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 1990
Filed:
Jun. 09, 1988
Applicant:
Inventor:
Richard T Girard, Coventryville, PA (US);
Assignee:
Valtech Corporation, Eagle, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
156250 ; 156276 ; 1563073 ; 156330 ; 156344 ; 4283139 ; 437226 ; 437249 ; 521 91 ; 523444 ;
Abstract
Profound improvements and advantages are realized in the process of cutting semiconductor ingots to provide wafers if the adhesive used to bond said ingot to a mounting or cutting beam contains hollow microspheres.
Girard, Richard. (1990). Method for preparing semiconductor wafers (U.S. Patent No. 4897141). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4897141
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile