This inventor holds 2 USPTO granted patents. Top assignee: Siemens Aktiengesellschaft. Active years: 1993-2001.
Location History:
- Kleinpruefening, DE (1993)
- Sinzing, DE (2001)
Company Filing History:
Years Active: 1993-2001
Title: Richard Scheuenpflug: Innovator in Semiconductor Technology
Introduction
Richard Scheuenpflug is a notable inventor based in Sinzing, Germany. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to connecting semiconductor chips.
Latest Patents
His latest patents include a "Carrier element for a semiconductor chip" and a "Method and apparatus for connecting a semiconductor chip to a carrier." The carrier element is designed for incorporation in smart cards and can be soldered onto circuit boards using SMD technology. This invention features a copper lamination of a plastic sheet that is structured through etching to form contact areas in one piece with conductor tracks, enabling reliable soldering. The method and apparatus for connecting a semiconductor chip to a carrier system allow for a more efficient process, significantly reducing time and capital outlay compared to prior art systems. The semiconductor chip is detached from a self-adhesive foil and precisely placed onto the carrier system, which is equipped with joining material at designated locations.
Career Highlights
Richard Scheuenpflug is associated with Siemens Aktiengesellschaft, a leading global technology company. His work at Siemens has allowed him to develop and refine his innovative ideas in semiconductor technology.
Collaborations
He has collaborated with notable coworkers, including Volker Rohde and Detlef Houdeau, contributing to advancements in their respective fields.
Conclusion
Richard Scheuenpflug's contributions to semiconductor technology through his patents reflect his innovative spirit and dedication to improving manufacturing processes. His work continues to influence the industry and pave the way for future advancements.
