The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 1993
Filed:
Dec. 03, 1992
Richard Scheuenpflug, Kleinpruefening, DE;
Siemens Aktiengesellschaft, Munich, DE;
Abstract
A method and an apparatus for connecting a semiconductor chip to a carrier system, wherein the semiconductor chip that is already detached but is still situated in the wafer union and that is held on a self-adhesive foil is detached therefrom and move onto a prescribed connecting location on the carrier system and connected thereto. The placement of the semiconductor chip onto the carrier system involves considerably less expenditure of time and capital outlay than the prior art systems. The carrier system is provided with a joining material at the prescribed connecting locations. The wafer union on the self-adhesive foil is aligned such that the surface of a semiconductor chip to be connected lies opposite the location of the carrier system that is provided with the joining material. The semiconductor chip in the wafer union is brought to a spacing of .ltoreq.0.2 mm above the carrier system and is ejected from the wafer union with a thrust mechanism onto the connecting location of the carrier system and is connected thereto. The method and the apparatus are particularly employed in SMD chip mounting.