Richard Regner is a notable inventor based in Boise, ID (US), recognized for his contributions to electronic substrate technology. With a total of 5 patents, Regner has made significant advancements in the field, particularly in the area of printing stencils and soldered integrated circuit connections.

Latest Patents

One of Regner's latest patents focuses on printing stencils for electronic substrates. These stencils are designed to provide precise alignment of stencil orifices with terminals or "targets" on a substrate, such as a printed circuit board (PCB). The stencil includes a body and an array of printing orifices that vary in size based on their distance from a specific locus. Additionally, various methods for applying solder on electronic substrates using these stencils have been developed. Another significant patent involves soldered integrated circuit connections, where solder paste is deposited using a stencil with a concave edge to minimize the formation of solder balls. This innovative approach allows for more effective solder deposits on adjacent pads.

Career Highlights

Regner's career is marked by his work at Micron Technology Incorporated, where he has been instrumental in developing cutting-edge technologies related to electronic substrates. His expertise in the field has led to numerous innovations that enhance the manufacturing process of electronic components.

Collaborations

Throughout his career, Regner has collaborated with talented individuals such as Scott Butler and Carey Blue. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Richard Regner's work in electronic substrate technology showcases his innovative spirit and dedication to advancing the field. His patents reflect a commitment to improving manufacturing processes and enhancing the performance of electronic components.

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