Micron Technology Incorporated

Richard Regner

Carey Blue

Scott Butler

Tony M Teitenberg

John S Godfrey

Gary L Chadwick

Stencils are provided for more precisely aligning stencil orifices with terminals or &ldquo;targets&rdquo; on a substrate. One such stencil is adapted for registration with an electronic substrate, such as a PCB, about a locus. The stencil includes a stencil body and an array of printing orifices passing through the stencil body. The printing orifices may have varying sizes, with the size of each printing orifice being a function of a distance of the printing orifice from the locus. Various methods are also provided, including methods for applying solder on electronic substrates using stencils and methods and systems for designing such stencils.

Printing stencils for electronic substrates

Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.

Soldered integrated circuit connections

Method for depositing solder paste on a pad

Growing community of inventors

Boise, ID, United States of America

Richard Regner