Gurnee, IL, United States of America

Richard Nelson

This inventor holds 1 USPTO granted patent. Top assignee: Encore Packaging LLC. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard Nelson. Retrieved from https://idiyas.com/inventor/richard-nelson-xatacbb0

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Richard Nelson: Innovator in Packaging Solutions

Introduction

Richard Nelson is a notable inventor based in Gurnee, Illinois. He has made significant contributions to the field of packaging and shipping through his innovative designs. His work focuses on enhancing the safety and efficiency of packaging solutions.

Latest Patents

Richard holds a patent for a corner protector designed specifically for packaging and shipping. This invention aims to prevent damage to goods during transit, ensuring that products arrive at their destination in optimal condition. He has 1 patent to his name, showcasing his commitment to innovation in this area.

Career Highlights

Richard is currently employed at Encore Packaging LLC, where he applies his expertise in packaging solutions. His role involves developing new products that meet the evolving needs of the shipping industry. His dedication to improving packaging methods has made a positive impact on the company and its clients.

Collaborations

Richard collaborates with his coworker, Timothy H. Nelson, to further enhance their product offerings. Together, they work on innovative solutions that address common challenges in packaging and shipping.

Conclusion

Richard Nelson's contributions to the packaging industry through his patented inventions demonstrate his innovative spirit and commitment to improving shipping solutions. His work at Encore Packaging LLC continues to influence the way products are packaged and transported.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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