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USPTO Data Jan 1 1976 - Oct 20 2026
38 Patents
#5 in Vernon Hills, IL
#501 in Illinois
#9,033 in US
#17,860 in the World
Encore Packaging LLC
Forward Citations = 204
8 inventors:
Vernon Hills, IL, United States of America
Encore Packaging LLC
Trademarks = 1
Forward Citations = 204
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8 inventors (with patents filed for the assignee):
Timothy H Nelson (38 out of 40 patents)
Stephenson Nelson (13 out of 13 patents)
John Parks (3 out of 9 patents)
4. Yinghao Shi (2 out of 2 patents)
5. Richard Bustard Nelson (2 out of 2 patents)
6. Duncan Hughes (1 out of 1 patent)
7. Oliver Harris (1 out of 1 patent)
8. Richard Nelson (1 out of 1 patent)
Core Competencies:
In-Line Packing Dispenser
Orthogonal Dispenser
Strapping Buckle
Corner Protector
Magnetic Hook
Packaging Spike
Stretch Film Processing
Wrapping Apparatus
Pallet Securing Mechanism
Rolled Material Dispensing
Clip for Securing Rope
Brake for Material Dispensing
38 patents:
Company Overview
Encore Packaging LLC, based in Vernon Hills, IL, specializes in providing innovative packaging solutions tailored to various industries. The company focuses on developing sustainable packaging materials and technologies that enhance product protection while minimizing environmental impact. With a commitment to quality and efficiency, Encore Packaging serves a diverse clientele, leveraging advanced manufacturing techniques to meet the evolving needs of the market. Their expertise spans multiple sectors, ensuring reliable and effective packaging solutions.
Profile summary synthesized from public USPTO records and patent filings.
IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Encore Packaging LLC. Retrieved from https://idiyas.com/company/encore-packaging
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]