Richard Michael Kozlowski

Title: Richard Michael Kozlowski: Innovator in Via Fill Compositions

Introduction

Richard Michael Kozlowski is a notable inventor based in Apalachin, NY (US). He holds a total of 4 patents that showcase his contributions to the field of technology and engineering. His work primarily focuses on improving solder joint applications in electronic devices.

Latest Patents

Kozlowski's latest patents include innovative methods for via fill compositions that allow for direct attachment of devices. His inventions enable solder joints to be made directly to vias and through holes without the solder being wicked into them. By filling plated through holes with an epoxy or cyanate fill composition, the cured material provides support for the solder joint and creates a flat solderable surface for interconnections. In certain embodiments, these cured fill compositions also offer the advantage of being conductive. His inventions relate to several novel methods for filling through holes with such compositions, as well as resistors located in these vias and holes.

Career Highlights

Throughout his career, Richard has worked with prominent companies, including IBM. His experience in these organizations has contributed significantly to his expertise and the development of his patented technologies.

Collaborations

Kozlowski has collaborated with several professionals in his field, including Roy Lynn Arldt and Christina Marie Boyko. These collaborations have likely enriched his work and led to further innovations.

Conclusion

Richard Michael Kozlowski is a distinguished inventor whose work in via fill compositions has made a significant impact in the electronics industry. His patents reflect his commitment to advancing technology and improving manufacturing processes.