Growing community of inventors

Apalachin, NY, United States of America

Richard Michael Kozlowski

Average Co-Inventor Count = 13.00

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 45

Richard Michael KozlowskiVoya Rista Markovich (4 patents)Richard Michael KozlowskiJohn M Lauffer (4 patents)Richard Michael KozlowskiKostas I Papathomas (4 patents)Richard Michael KozlowskiRichard A Schumacher (4 patents)Richard Michael KozlowskiChristina Marie Boyko (4 patents)Richard Michael KozlowskiIssa S Mahmoud (4 patents)Richard Michael KozlowskiJoseph Duane Kulesza (4 patents)Richard Michael KozlowskiJoseph Gene Sabia (4 patents)Richard Michael KozlowskiRoy Lynn Arldt (4 patents)Richard Michael KozlowskiBurtran Joe Cayson (4 patents)Richard Michael KozlowskiPhilip Chihchau Liu (4 patents)Richard Michael KozlowskiJames Francis Muska (4 patents)Richard Michael KozlowskiRichard Michael Kozlowski (4 patents)Voya Rista MarkovichVoya Rista Markovich (252 patents)John M LaufferJohn M Lauffer (130 patents)Kostas I PapathomasKostas I Papathomas (59 patents)Richard A SchumacherRichard A Schumacher (31 patents)Christina Marie BoykoChristina Marie Boyko (22 patents)Issa S MahmoudIssa S Mahmoud (18 patents)Joseph Duane KuleszaJoseph Duane Kulesza (14 patents)Joseph Gene SabiaJoseph Gene Sabia (7 patents)Roy Lynn ArldtRoy Lynn Arldt (6 patents)Burtran Joe CaysonBurtran Joe Cayson (5 patents)Philip Chihchau LiuPhilip Chihchau Liu (4 patents)James Francis MuskaJames Francis Muska (4 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. International Business Machines Corporation (3 from 164,244 patents)

2. Other (1 from 832,912 patents)


4 patents:

1. 6194024 - Via fill compositions for direct attach of devices and methods for applying same

2. 6134772 - Via fill compositions for direct attach of devices and methods of

3. 5766670 - Via fill compositions for direct attach of devices and methods for

4. 5571593 - Via fill compositions for direct attach of devices and methods for

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1/8/2026
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