The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2001
Filed:
Jun. 06, 1995
Roy Lynn Arldt, Georgetown, TX (US);
Christina Marie Boyko, Conklin, NY (US);
Burtran Joe Cayson, Austin, TX (US);
Richard Michael Kozlowski, Apalachin, NY (US);
Joseph Duane Kulesza, Binghamton, NY (US);
John Matthew Lauffer, Waverly, NY (US);
Philip Chihchau Liu, Endwell, NY (US);
Voya Rista Markovich, Endwell, NY (US);
Issa Said Mahmoud, Apalachin, NY (US);
James Francis Muska, Johnson City, NY (US);
Kostas Papathomas, Endicott, NY (US);
Joseph Gene Sabia, Norwich, NY (US);
Richard Anthony Schumacher, Endicott, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.