Philip Chihchau Liu

Title: The Innovations of Philip Chihchau Liu

Introduction

Philip Chihchau Liu is an accomplished inventor based in Endwell, NY (US). He holds a total of four patents, showcasing his significant contributions to the field of technology and engineering. His work primarily focuses on enhancing the efficiency and effectiveness of solder joints in electronic devices.

Latest Patents

Among his latest patents is a groundbreaking invention titled "Via fill compositions for direct attach of devices and methods for applying same." This invention allows solder joints to be made directly to vias and through holes without the solder being wicked into them. By filling plated through holes with an epoxy or cyanate fill composition, the invention ensures that when cured and overplated, the fill composition provides support for the solder joint and creates a flat solderable surface for inter-connection. In certain embodiments, the cured fill compositions also offer the advantage of being conductive. The invention further relates to several novel methods for filling through holes with such fill compositions, as well as to resistors located in through holes and vias.

Career Highlights

Philip has had a notable career, having worked with prestigious companies such as IBM. His experience in these organizations has allowed him to refine his skills and contribute to significant technological advancements.

Collaborations

Throughout his career, Philip has collaborated with talented individuals, including Roy Lynn Arldt and Christina Marie Boyko. These collaborations have likely enriched his work and led to innovative solutions in his field.

Conclusion

Philip Chihchau Liu's contributions to the field of technology through his patents and collaborations highlight his role as a significant inventor. His innovative approaches to solder joint applications continue to influence the industry.