Growing community of inventors

Endwell, NY, United States of America

Philip Chihchau Liu

Average Co-Inventor Count = 13.00

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 45

Philip Chihchau LiuVoya Rista Markovich (4 patents)Philip Chihchau LiuJohn M Lauffer (4 patents)Philip Chihchau LiuKostas I Papathomas (4 patents)Philip Chihchau LiuRichard A Schumacher (4 patents)Philip Chihchau LiuChristina Marie Boyko (4 patents)Philip Chihchau LiuIssa S Mahmoud (4 patents)Philip Chihchau LiuJoseph Duane Kulesza (4 patents)Philip Chihchau LiuJoseph Gene Sabia (4 patents)Philip Chihchau LiuRoy Lynn Arldt (4 patents)Philip Chihchau LiuBurtran Joe Cayson (4 patents)Philip Chihchau LiuRichard Michael Kozlowski (4 patents)Philip Chihchau LiuJames Francis Muska (4 patents)Philip Chihchau LiuPhilip Chihchau Liu (4 patents)Voya Rista MarkovichVoya Rista Markovich (252 patents)John M LaufferJohn M Lauffer (130 patents)Kostas I PapathomasKostas I Papathomas (59 patents)Richard A SchumacherRichard A Schumacher (31 patents)Christina Marie BoykoChristina Marie Boyko (22 patents)Issa S MahmoudIssa S Mahmoud (18 patents)Joseph Duane KuleszaJoseph Duane Kulesza (14 patents)Joseph Gene SabiaJoseph Gene Sabia (7 patents)Roy Lynn ArldtRoy Lynn Arldt (6 patents)Burtran Joe CaysonBurtran Joe Cayson (5 patents)Richard Michael KozlowskiRichard Michael Kozlowski (4 patents)James Francis MuskaJames Francis Muska (4 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. International Business Machines Corporation (3 from 164,108 patents)

2. Other (1 from 832,680 patents)


4 patents:

1. 6194024 - Via fill compositions for direct attach of devices and methods for applying same

2. 6134772 - Via fill compositions for direct attach of devices and methods of

3. 5766670 - Via fill compositions for direct attach of devices and methods for

4. 5571593 - Via fill compositions for direct attach of devices and methods for

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as of
12/4/2025
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